Liquid cooling moves onto the chip for denser electronics

Liquid cooling moves onto the chip for denser electronics
Atlanta GA (SPX) Oct 07, 2015 - Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it's needed the most - a few hundred microns away from where the transistors are operating. Combined with connection technology that operates through structures in the cooling passages, the ... more

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