Techniques to cool 3D integrated circuits stacked like a skyscraper

Techniques to cool 3D integrated circuits stacked like a skyscraper
Greenbelt MD (SPX) Oct 28, 2015 - Future integrated circuitry is expected to look a lot like skyscrapers: units will be stacked atop one another and interconnects will link each level to its adjacent neighbors, much like how elevators connect one floor to the next. The problem is how do integrated-circuit designers remove heat from these tightly packed 3-D chips? The smaller the space between the chips, the harder it is to remov ... more

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