Sunday, 4 September 2016

Continuous roll-process technology for transferring and packaging flexible LSI


CHIP TECH
Continuous roll-process technology for transferring and packaging flexible LSI Daejeon, South Korea (SPX) Sep 01, 2016 - A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has jointly developed a continuous roll-processing technology that transfers and packages flexible large-scale integrated circuits (LSI), the key element in constructing the computer's brain such as CP ... more

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